29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“I really enjoyed ESREF in Aalborg and was very pleased with all the arrangements and the overall logistical organization of the conference at this beautiful location. I should say it was a roaring success with a record number of submissions, exhibitors and a beautifully planned out program with adequate opportunities for technical interactions and social networking. I hope to attend ESREF more consistently in the years to come and look forward to more learning experiences there with different cultural connections to different parts of Europe!”

Nagarajan Raghavan (IPFA Co-Chair, SUTD, Singapore)




INVITED SPEECH
Paul Pfaeffli - Synopsys Switzerland LLC
TCAD Modelling for Reliability
Abstract
Technology Computer Aided Design (TCAD) tools can be used to effectively study and analyze a multitude of reliability issues in semiconductor devices. In the following article, we first describe Negative-Bias Temperature Instability (NBTI), which is one of the most severe reliability issues. Using the Reaction-Diffusion (RD) model for simulating the NBTI effect, we show that the simulated threshold voltage degradation agrees well with measured data. Based on the simulation results, we propose an on-chip heater to enhance recovery and revert the NBTI degradation. Next, we discuss how to apply the Hot-Carrier Stress (HCS) model to analyze hot carrier degradation in FinFET. We show that the threshold voltage shift agrees well with experiment and use the HCS model for the simulation of breakdown voltage walkout in a LDMOS transistor. Then, we apply process emulation to better understand modern DRAM structures and illustrate the row hammering reliability issue. Finally, we demonstrate a multi-level sub-modeling methodology for chip to package interaction (CPI) and apply the method to study the effect of wafer bending on the reliability of re-distribution layers (RDL).
Biography
Paul Pfaeffli studied Physics at ETH Zurich and received his Ph.D. degree from the Institute for Integrated Systems at ETH Zurich in 1999. Since 2007 he is Director of Application Engineering at Synopsys, responsible for TCAD customer support in Europe.
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