29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018
29th European Symposium on Reliability of Electron Devices, Failure Physics and Analysis
AALBORG, DENMARK - OCTOBER 1-5, 2018


“I really enjoyed ESREF in Aalborg and was very pleased with all the arrangements and the overall logistical organization of the conference at this beautiful location. I should say it was a roaring success with a record number of submissions, exhibitors and a beautifully planned out program with adequate opportunities for technical interactions and social networking. I hope to attend ESREF more consistently in the years to come and look forward to more learning experiences there with different cultural connections to different parts of Europe!”

Nagarajan Raghavan (IPFA Co-Chair, SUTD, Singapore)



“I had a great time at ESREF 2018. I learned a lot from the technical talks especially on the GaN reliability. I got chance to network with many other researchers/engineers from academia and industries. The social event at Voergaard Castle was also very well organized, served with a great food and very entertaining shows. Overall, I can say ESREF 2018 was a great success. Congratulations to all the organizers! Looking forward to attend ESREF 2019”

Wardhana A. Sasangka (IPFA 2019 Technical Program Co-Chair/SMART, Singapore)



“It was excellent, from the content and from the organisation”

“Even if I think very hard I cannot come with any idea what could be improved at all”

“The catering was perfect”

Andreja Rojko, ECPE



“I really enjoyed taking part”

Stefan Oberhoff, Bosch

“Thank you for organizing the conference, I really enjoyed it very much!”

Daniel Beckmeier, Infineon



“Really, ESREF2018 was a great conference!”

Paolo Cova

“Indeed, it was a very interesting, and also very well organized, conference”

Paolo Mangone



“Very well organized ESREF conference”

Søren Jørgensen, Grundfos

“Thanks for organising the ESREF conference. It was a good one”

Jose Ortiz Gonzalez



“Thank you for this great conference. I enjoyed it a lot”

Shahriyar Kaboli

“You did a great job”

Giovanna Mura



“First keynote speaker is superb”

“Great presentations, good topics”

“The organisation was great”

Anonymous conference participants (on the 1st conference day)



“Highly interesting keynote from ITRS”

“The location has enough room for all the visitors”

“My favourite is the app”

Anonymous conference participants (on the 1st conference day)



“The food was good”

“Very interesting first day”

“Good overview of several subjects during tutorials”

Anonymous conference participants (on the 1st conference day)



“A nice event”

“Great opportunity to meet people from other countries and fields”

“It is very positive”

Anonymous conference participants (on the Young Professional Reception)



“Thanks to all the organization”

“Nice opportunity to network”

“I liked the setting”

Anonymous conference participants (on the Young Professional Reception)



“Very good”

“I have collected only positive experiences”

“Excellent”

Anonymous conference participants (on the 3rd conference day)



“It was my best dinner”

“Really it was a pleasure”

“The bus travel was greatly organised”

Anonymous conference participants (on the Gala Dinner)



“Interesting small stories around the castle”

“The location was wonderful”

“The idea with the historical touch was very entertaining”

Anonymous conference participants (on the Gala Dinner)



“Amazing!”

“Super fun!”

“Very nice!”

Anonymous conference participants (on the Gala Dinner)



“I really enjoyed the drinks, food and the best was maybe the organiser and the artists”

“A very nice, unique and original event – well done”

Anonymous conference participants (on the Gala Dinner)





TUTORIAL LECTURE
Andreas Middendorf - Fraunhofer IZM
Reliability of packages for power devices
Abstract
Today packaging of power devices is a fast developing subject, as new materials and concepts emerge. At the same time reliable operation throughout the lifetime needs to be ensured from the package development. This tutorial will give an overview of the actual trends in power electronic packaging and the related reliability aspect associated within. It will start from a general introduction of the basic methodology. Packaging solution options will be presented ranging from different materials for wire bonding and die attach to different integration concepts (embedding concepts). Associated possible failure mechanisms will be explained as this knowledge is the basis for suitable modelling and test planning. Typical models will be introduced and test examples given. Thus a basis for the Design and Test for Reliability is given.
Biography
Andreas Middendorf works as a business developer in the Business Development Team of the Fraunhofer Institute for Reliability and Microintegration (IZM). He was working as a scientist in the department Environmental and Reliability Engineering of the Fraunhofer Institute for Reliability and Microintegration (IZM) and of the Technical University Berlin since May 1995. He was responsible for the development and implementation of methods and demonstrators for the estimation of lifetime for electronic appliances. Further on he is investigating technological aspects which combine the electronics design with environmental engineering techniques. This includes environmental assessments through LCA and through other methods, especially for Eco-Design, the evaluation of recycling attributes, the development of databases and software as well as environmental oriented product evaluation. He is lecturer of courses on EcoDesign and Reliability at the Technical University Berlin and the HTW Berlin. Further on he carried out courses on EcoDesign and Reliability for electronic companies, holds four patents and has coordinated several cooperative research projects in Germany and Europe. Since 2010 until 2015 he was senior manager for the application field automotive and transportation systems and in charge for the System Reliability and Measurement Group at IZM. He studied electrical engineering at the Technical Universities of Aachen and Wuppertal where he specialized on information and communication technologies.
Olaf Wittler - Fraunhofer IZM
Reliability of packages for power devices
Biography
Dr. Olaf Wittler studied physics in Paderborn, Berlin and London and received his diploma degree in 1999. Afterwards he worked on his Ph.D. thesis at Robert Bosch GmbH on a methodology to include viscoelastic effects in the finite element analysis of cracks of polymer encapsulations. In 2002 he joined Fraunhofer IZM / TU Berlin and continued to work on thermal and thermomechanical reliability in power electronic packaging. Since 2010 he is heading the Fraunhofer IZM department Environmental and Reliability Engineering together with Dr. Nils F. Nissen. He has authored and co-authored several papers in the fields of laser physics, thermomechanical material characterisation and reliability simulation of electronic packages.
Powered by PMWiki
Visit statistic by Google Analytics