Exhibitor
  | Booth 22 Fraunhofer IMWS and Fraunhofer IZM | |
| Description | ||
| Fraunhofer IMWS-CAM is a leading service provider of failure diagnostics and material assessment for industry including semiconductor technologies, microelectronic components, microsystems and nanostructured materials. We consider the entire workflow from non-destructive defect localization over high precision target preparation to cutting-edge nanoanalytics supplemented by micro-mechanical testing, finite element modeling and numerical simulation. Our goal is to support cooperation partners in introducing innovative materials and technologies, improving manufacturing process steps, securing reliable field use of components, analyzing field returns, and consequently optimizing manufacturing yield, product quality, reliability, and cost efficiency. In addition, we are collaborating with suppliers of microstructure diagnostics and material testing equipment in developing innovative failure analysis methods and instrumentation, problem-adapted workflows for quality and reliability control, and new industry-compatible applications for future markets. Fraunhofer IZM specializes in industry-oriented applied research. Fraunhofer IZM develops assembly and interconnection technology, also known as electronic packaging. Almost invisible and undervalued by many, electronic packaging is at the heart of every electronic application. Our technologies connect the individual components, protect components and devices from vibration and moisture, and reliably dissipate heat. Fraunhofer IZM thus ensures that electronic devices continue to function reliably in even the harshest conditions. Modern packaging technologies make developing smaller and smaller products possible. We process ICs thinner than a sheet of paper. The institute, founded in 1993, has a staff of more than 300 and disposes of a lab area of more than 8,000 sqm. More than 80 percent of our turnover in 2017 was earned through contract research. | ||
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