| INVITED SPEECH | ||
 | Frank Altmann - Fraunhofer IMWS, Center for Applied Microstructure Diagnostics CAM Analytics for physics of failure in automotive applications | |
| Abstract | ||
| The robustness margins for automotive electronics are getting smaller due to growing complexity in technology and increasingly challenging use cases. Formal qualification based on electrical testing without microstructure analysis and without EOL testing for deeper understanding of failure risks increases the probability of field returns. Failure root causes include complex interactions between chip, package and system in combination with specific details of the mission profile. In this talk illustrative examples of complex defect mechanisms will be presented demonstrating the need for robustness validation-oriented physics of failure approaches. It will be shown that robustness validation can benefit from precompetitive research on physics of failure concepts prior to reliability investigation of products. | ||
| Biography | ||
| Frank Altmann received his Diploma in Physics from the Technical University, Dresden. In 1997 he started at Fraunhofer as scientist for electron microscopy and FIB working on failure analysis for integrated circuits. Since 2006 he has been working as head of the research group »Diagnostics of semiconductor technologies« at the Fraunhofer Institute for Microstructure of Materials and Systems. His team is dealing with the development of novel techniques for focused ion beam sample preparation, SEM based current and active dopant contrast imaging and lock-in thermography defect localization. Furthermore, Frank works on advanced failure analysis techniques for 3D packages and holds patents for 3D LIT approaches. He has authored and co-authored more than 60 publications and is co-organizer of the European FIB Workshops EUFN and EFUG. Since 2012 he has been organizing the International CAM Workshop on Innovations in Failure Analysis and Material Diagnostics of Electronics Components. In 2016 he acted as technical program chair for the European Symposium on Reliability of Electron Devices, Failure Physics and Analysis Conference (ESREF). | ||
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